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MECHANIC INSULATION JUMPER WIRE FOR IPHONE MOTHERBOARD REPAIR FXS-9 200MX0.02MM

MECHANIC INSULATION JUMPER WIRE FOR IPHONE MOTHERBOARD REPAIR FXS-9 200MX0.02MM

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ID: MV-201219P93X59
Weight: 0.40 kg
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Description

Product details of MECHANIC INSULATION JUMP WIRE FOR IPHONE MOTHERBOARD REPAIR FXS-9 200MX0.02MM - 0.02mm iphone motherboard chip jump wire, diagmeter 0.02mm precise connection Copper wire Cutting cable, iphone chip conductor wire for PCB BGA Sodering Point,ensure there is no short- circuit between 0.1mm solder joints, totally beat handset cable.diagmeter: 0.02mm, length:150m, durable and tensile iphone motherboard fingerprint repair jump wire /Jumper wire.

- iphone fingerpringt jump wire, phone motherboard repair connection cables, diagmeter: 0.02mm, length:150m.The wire is not enameled wire, It's made of pure copper, and the surface is conductive

- The wire is small and easy to be straightened, and the diameter is around 0.02 mm

- It can also be straightened to smaller, which is suitable for iPhone repairing fingerprint and other small soldering point

MECHANIC INSULATION JUMPER WIRE FOR IPHONE MOTHERBOARD REPAIR FXS-9 200MX0.02MM

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