Mechanic IX50 Motherboards Preheating Platform Supports iPhone 11 to 17 Series
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Seller: Martview Shenzhen
ID: MV-260903LZ8577
Weight: 0.35 kg
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Description
Mechanic IX50 Motherboards Preheating Platform Supports iPhone 11 to 17 Series
Features:
- Suitable for tinning, delamination, desoldering, and adhesive removal from chips on mobile phone motherboards
- CRV quenching hardening, wear-resistant, anti-collapse, and non-deformation
- Dismantling and soldering of motherboard chips, tin plating and adhesive removal
- Component preheating, BGA/CPU hard drive disassembly and assembly, layered bonding and tin removal repair of circuit boards
- Optional 11-17 hollow module for expanding multi-scene heating
Package includes:
- 1 x Preheating Platform
- 1 x Power Cable
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