Mechanic MagTin Max 2.0 Magnetic Dual-Sided BGA Reballing Platform Set with 90Pcs Stencils for iPhone / Android

Mechanic MagTin Max 2.0 Magnetic Dual-Sided BGA Reballing Platform Set with 90Pcs Stencils for iPhone / Android

Features:

• Quickly adapt to different CPU clamping

• Fast fixation and precise positioning

• High temperature resistance, fast heat dissipation

• Brand-new design, convenient storage

• The set includes : The main body x1 of the tin planting table and x90 pieces of steel mesh (Apple 12 Sheets + Samsung 12 Sheets + Hisilicon 12 Sheets + Qualcomm 21 Sheets + MediaTek 21 Sheets + EMMC+RAM 12 Sheets)

Models include:

• Qualcomm: SM8750, SM8450, SM8150, SM7325, SM7125, SM8650, SM8350, SM7550, SM7250, SM7750, SM6450/SM7435, SM8550, SM7150, SM7450, SM8475, SM7475, SM8250-102 Small,  SM7350, SM8250-002 Big, SM7225-00AB, SM8850, SM8735

• MTK: MT6989W, MT6895Z, MT6855V, MT6853V, MT6983Z, MT6885Z, MT6873V/6875V, MT6891Z/6893Z, MT6878V, MT6899Z, MT6991Z, MT6985W, MT6897Z, MT6877V, MT8781/MT6789V, MT6761V/6762V/6765, MT6833V, MT6886V, MT6781V, MT6835V, MT6993Z

• Apple: A19Pro, A19 A18Pro, A18, A17, A16, A15, A14, A13, A12, A11, A10

• Exynos: Exynos 2200, Exynos 9820, Exynos 8895, Exynos 2100, Exynos 980, Exynos 990, Exynos 1330-E8535P, Exynos 1380-E8835P, Exynos 1480-E8845, Exynos 1280-E8825, Exynos 9815/1080, Exynos 2400-E9945

• Hisilicon: Hi36C0, Hi3690-5G, Hi6280, Hi36A0, Hi3670, Hi36D0, Hi36A0, Hi3690-4G, Hi3680, Hi6290/L, Hi6290, Hi62B0

• EMMC+RAM: BGA 254 Small, BGA 169, BGA 134, BGA 436, BGA 178 Small, BGA 153, BGA 186, BGA 162, BGA 556, BGA 376, BGA 496, BGA 221

Package includes:

• 1 x Magnetic Base

• 90 x Stencil