Mechanical IX5 Ultra Universal Preheating Platform for Motherboard Planting Tin / Degumming
0 out of 5 stars
No review yetOut of stock
NaN
As low as NaN
Worldwide shipping
Seller: Martview Shenzhen
ID: MV-230912V49D8D
Weight: 0.30 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -3.1% |
| 5 | NaN | -4.6% |
| 10 | NaN | -6.9% |
Please select Voltage
Choose a Voltage
110V220V
Extra Adapter
Choose a Extra Adapter
AUEUUKUS
Product details
Description
Mechanical IX5 Ultra Universal Preheating Platform for Motherboard Planting Tin / Degumming
Features:
- Mechanic IX 5 Ultra universal breakthrough preheating platform, no air gun, no soldering iron, uniform heating
- Layering / Tinning / Laminating / Degumming, Compact & Lightweight
- Uniform heating, no air gun, no solder iron, aluminum alloy panel, freely controlled temperature
- Fit all sizes of cell phone motherboards, support motherboard delamination, lamination, dot matrix repair
Specification:
- Name: Universal Preheating Platform
- Gross Weight: 381.7g
- Model: Breakthrough iX 5Ultra
- Net Weight: 181.7g
- Voltage 110V /220V
- Product Size: 80*80*57.6mm
- Package Size 182*150*55mm
- Scope: Support motherboard delamination, lamination, and dot matrix repair
- Preheating Temperature Range: 20~260°C
Package includes:
- 1 x Preheating Platform
- 1 x Power Cable
Customer reviews
0.0/ 5.0
0
0
0
0
0
