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Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform for iPhone 14 Series

mega idea-multi-functional-middle-frame-positioning-bga-reballing-platform-for-iphone-14-series-1

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ID: MV-230210Q9E7WC
Weight: 0.15 kg
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Product details

Description

Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform for iPhone 14 Series

Features:
  • Strong magnetic universal base, various models for more expansions of reballing
  • Mega-idea Multi-functional Reballing Platform supports iPhone 14/14 Plus/14 Pro/14Pro Max
  • Applicable to Mega-idea Multi-functional Middle Frame Reballing Platform Use with the base will update more models
  • Strong magnetic universal base with three strong magnetic magnet
  • Universal base for all models, a lifetime experience in one purchase
  • Replace and add up updated models for more expansions
  • Models keep updating, add up without limits, free from base replacements
  • CNC high precision one-piece machining, stable positioning of the motherboard, no slanting when reballing
  • Anti-slip foot pad of the base, two anti-slip silicone foot pads, avoid slippery during reballing
  • Detailed process in each step of reballing, secure clamping of the motherboards in high temperatures
  • Avoid the large area of mesh detaching at the same time, resulting in solder paste being carried away

Specification:
  • Brand: Mega-idea
  • Product: Mega-idea Multi-functional Middle Frame Reballing Platform
  • Models: Multi-functional magnetic universal base
  • Functions: Motherboard reballing and repair
  • Material: Synthetic Stone, Steel
  • Reballing Platform Packaging Size: 61*101*8.5mm
  • Base Packaging Size: 67*107*13mm
  • Reballing Platform Weight: 32g
  • Base Weight: 118g

How to Use: 
  • Motherboard Installation precise positioning, place the motherboard on the corresponding positioning columns Match the model, and place them on the synthetic stone reballing platform
  • Place the reballing platform into the universal base and attach the reballing platform to the magnetic base
  • Place the corresponding model of the stencil on the corresponding reballing platform, and attach it to the magnetic base
  • Apply low-temperature solder paste evenly on the stencil mesh
  • After applying the paste, remove the stencil, do not use a hot air gun to blow directly on the stencil
  • After removing the stencil, use the hot air gun to heat it again, and blow until the paste has melted

Package includes:
  • 1 x Reballing Platform
mega idea-multi-functional-middle-frame-positioning-bga-reballing-platform-for-iphone-14-series-1
mega idea-multi-functional-middle-frame-positioning-bga-reballing-platform-for-iphone-14-series-2
mega idea-multi-functional-middle-frame-positioning-bga-reballing-platform-for-iphone-14-series-3

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