Mijing H210 Series High-Precision Copper Heating Core Soldering Tips for Mobile Phone PCB Repair

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Seller: Martview Shenzhen
ID: MV-2512123TRK7D
Weight: 0.15 kg
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Description
Mijing H210 Series High-Precision Copper Heating Core Soldering Tips for Mobile Phone PCB Repair
Features:
- Fast Heat Conduction: The red copper substrate ensures rapid and efficient heat transfer
- Oxidation Resistance & Long Life: Built to last with materials that resist wear
- Easy Tinning: Designed for quick and reliable solder adhesion
- Rust-Proof Nickel-Plated Layer: Enhances durability and prevents corrosion
- Chromium Plating: Adds an extra layer of protection and improves performance
- Stainless Steel Housing: Minimizes heat loss for consistent temperature control
- Built-In High-Power Heat Core: Delivers reliable power for various soldering needs
Available Models:
- H210-I: Ultra-sharp 0.3mm tip. Perfect for precision soldering in confined spaces and operations under a microscope
- H210-S: Ultra-sharp 0.3mm tip. Ideal for SMD welding under a microscope, patch work, flying wire, and detailed soldering
- H210-K: 2.6mm*1.3mm K-type tip. Widely used for bonding pads, chip processing, correction of tin bridges, connectors, and more
Package includes:
- 1 x Soldering Tips











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