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Mijing H210 Series High-Precision Copper Heating Core Soldering Tips for Mobile Phone PCB Repair

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ID: MV-2512123TRK7D
Weight: 0.15 kg
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H210-IH210-IH210-KH210-KH210-SH210-SFull Set/3PcsFull Set/3Pcs

Product details

Description

Mijing H210 Series High-Precision Copper Heating Core Soldering Tips for Mobile Phone PCB Repair

Features:
  • Fast Heat Conduction: The red copper substrate ensures rapid and efficient heat transfer
  • Oxidation Resistance & Long Life: Built to last with materials that resist wear
  • Easy Tinning: Designed for quick and reliable solder adhesion
  • Rust-Proof Nickel-Plated Layer: Enhances durability and prevents corrosion
  • Chromium Plating: Adds an extra layer of protection and improves performance
  • Stainless Steel Housing: Minimizes heat loss for consistent temperature control
  • Built-In High-Power Heat Core: Delivers reliable power for various soldering needs

Available Models:
  • H210-I: Ultra-sharp 0.3mm tip. Perfect for precision soldering in confined spaces and operations under a microscope
  • H210-S: Ultra-sharp 0.3mm tip. Ideal for SMD welding under a microscope, patch work, flying wire, and detailed soldering
  • H210-K: 2.6mm*1.3mm K-type tip. Widely used for bonding pads, chip processing, correction of tin bridges, connectors, and more

Package includes:
  • 1 x Soldering Tips
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