Mijing iPH-15 0.12mm BGA Square Holes Reballing Stencil for iPhone 12 / 12 Mini / 12 Pro / 12 Pro Max CPU
0 out of 5 stars
No review yetReady stock
NaN
As low as NaN
Worldwide shipping
Seller: Martview Shenzhen
ID: MV-220325343A6B
Weight: 0.03 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
Product details
Description
Mijing iPH-15 0.12mm BGA Square Holes Reballing Stencil for iPhone 12/12 Mini/12 Pro/12 Pro Max CPU
Features:
- MiJing high-quality BGA Reballing Stencil
- Ultra-thin steel template, just 0.12mm thickness,
- Precision square hole manual planting Tin net, for iPhone 12/12 Mini/12 Pro/12 Pro Max
- Laser engraving, grooves pinpoint
- German Craftsmanship, easy to use
Notice:
- Please Planting tin net again the chip foot, the temperature of the hot air gun is controlled within 250 degrees
- Too high temperature is going to make the product deformed, secure with tweezers planting tin net
- Apply the solder paste evenly, make sure that each hole is covered with solder paste, clean the surface of the steel net with a clean cloth
- Then blow and weld the ball with a hot air gun, after cooling slightly the steel net tube is separated from the chip
Package includes:
- 1 x Steel Net
Customer reviews
0.0/ 5.0
0
0
0
0
0
