Mijing iPH-17 0.12mm 2D BGA Square Holes Reballing Stencils for iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max CPU

Mijing iPH-17 0.12mm 2D BGA Square Holes Reballing Stencils  for iPhone 13/13 Mini/13 Pro/13 Pro Max CPU

Features:

• New patented stepped groove 2D BGA planting stencil, accurate alignment

• Stepped groove design enables stencil to align with tinning position of IC rapidly

• The square holes design makes it easier to take out the formed solder balls

• This 2D stencil is easy to use no matter whether you are a new or an expert.

• With the high success rate of planting tin, the solder balls can be formed once you are proficient

• No Need for IC Holder Station

• This 2D planting stencil is thicker than ordinary stencils in the market

• Less tendency of deformation makes its using life longer

Specification:

• Material: Stainless steel

• Weight: 0.01kg

• Type: 2D reballing template

• Model Number: MJ 2D Reballing Stencil

• Design: Stepped groove

• Suit: for iPhone 13 series

Package includes:

• 1 x Steel Net