Mijing R13 Heat-Insulating Tempered Glass IC Chips Degluing Clamp Universal for Small and Large ICs
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Seller: Martview Shenzhen
ID: MV-260829ZGT86C
Weight: 0.30 kg
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| 3 | NaN | -2.4% |
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Product details
Description
Mijing R13 Heat-Insulating Tempered Glass IC Chips Degluing Clamp Universal for Small and Large ICs
Features:
- High-temperature-resistant tempered glass panel, suitable for a variety of repair scenarios
- Stable operation / easy glue removal, universal for small and large ICs
- Dual-thickness workstations for precise adaptation to thick and thin ICs
- Multi-point serrated interlocking for shift-resistant clamping
- Stepless distance adjustment via knob, fine-tuning spacing, smooth screw rod
- Suitable for glue removal and lead repair on devices such as BGAs, CPUs, and ICs
Package includes:
- 1 x Clamp
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