Mijing Z20 4-in-1 BGA Reballing Platform for iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max Middle Layer Motherboard
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Seller: Martview Shenzhen
ID: MV-220325KPLGR8
Weight: 0.45 kg
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| 3 | NaN | -3.0% |
| 5 | NaN | -5.2% |
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Product details
Description
Mijing Z20 4-in-1 BGA Reballing Platform for iPhone 13/13 Mini/13 Pro/13 Pro Max Middle Layer Motherboard
Features:
- Mijing 4 in 1 BGA Reballing Stencil Platform for iPhone 13/ 13 Pro/ 13Pro Max/13Mini, convenient and faster for reballing BGA without any damage, offer you the best solution for iPhone 13 series BGA reballing and repairing
How to use:
- Install the main board on the platform
- Cover the BGA reballing stencil on the mainboard
- Evenly spread tin on the cover of the reballing stencil
- Remove the reballing stencil cover
- Take out the motherboard and cooperate with the hot air gun to solidify the tin point
Package includes:
- 1 x Fixture
- 4 x Steel mesh
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