Mijing Z20 4-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 / 14 Plus / 14 Pro / 14Pro Max

Mijing Z20 4-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 / 14 Plus / 14 Pro / 14Pro Max

Features:

• Mijing 4-in-1 BGA Reballing Stencil Platform for iPhone 14/ 14 Plus / 14 Pro/ 14Pro Max convenient and faster for reballing BGA without any damage, offer you the best solution for iPhone 14 series BGA reballing and repairing

How to use:

• Install the main board on the platform

• Cover the BGA reballing stencil on the mainboard

• Evenly spread tin on the cover of the reballing stencil

• Remove the reballing stencil cover

• Take out the motherboard and cooperate with the hot air gun to solidify the tin point

Package includes:

• 1 x Fixture

• 2 x Steel mesh