Mijing Z20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 18Pro / 18Pro Max
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Seller: Martview Shenzhen
ID: MV-261020CZ8MQN
Weight: 0.10 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
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only Basefor iPhone 18P/18PM/without BaseProduct details
Description
Mijing Z20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 18Pro / 18Pro Max
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