Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A18 Pro / Hisilicon / Qualcomm Snapdragon
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Seller: Martview Shenzhen
ID: MV-221011HD14Y2
Weight: 0.45 kg
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Description
Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A18 Pro/Hisilicon/Qualcomm Snapdragon
Features:
- Automatic precise positioning
- The new magnetic dynamic original positioning
- Strong magnetic force automatic clamping
Installation Method:
- Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
- Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
Package includes:
- 1 x Tin planting platform set
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