Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A18 Pro / Hisilicon / Qualcomm Snapdragon

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Seller: Martview Shenzhen

ID: MV-221011HD14Y2

Weight: 0.45 kg

Qty	Price	Discount
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3	NaN	-3.1%
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10	NaN Wholesale Price	-8.5%

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Product details

Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A18 Pro/Hisilicon/Qualcomm Snapdragon

Features:
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping

Installation Method:
Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)

Package includes:
1 x Tin planting platform set