Mijing Z22MAX CPU Chip Tin Planting BGA Reballing Stencil Platform for iPhone 11-17PM / Android
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Seller: Martview Shenzhen
ID: MV-260328126N86
Weight: 0.35 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -3.0% |
| 5 | NaN | -5.2% |
| 10 | NaN | -8.9% |
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Description
Mijing Z22 MAX CPU Chip Tin Planting BGA Reballing Stencil Platform for iPhone 11-17PM / Android
Package includes:
- 1 x Base
- 9 x Stencil
Customer reviews
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