Mijing Z24 CPU / Hard Drive / Wi-Fi / Baseband Mainboard Kit BGA Reballing Stencil Tin Plating Platform for iPhone 11-17PM
0 out of 5 stars
No review yetReady stock
NaN
As low as NaN
Worldwide shipping
Seller: Martview Shenzhen
ID: MV-2611129QB8YE
Weight: 0.60 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -3.1% |
| 5 | NaN | -5.4% |
| 10 | NaN | -8.5% |
Product details
Description
Mijing Z24 CPU / Hard Drive / Wi-Fi / Baseband Mainboard Kit BGA Reballing Stencil Tin Plating Platform for iPhone 11-17PM
Features:
- Precision machining + large positioning pins. No need for repeated alignment; simply place the component on the platform to apply solder. Compatible with the full iPhone 11 to 17 series.
- Covers key chips (CPU, hard drive, power supply, Wi-Fi, baseband, etc.) across different model variants, enhancing repair convenience.
- Highly magnetic positioning soldering platform with a high-temperature-resistant, ultra-thin positioning plate and solder mesh offering superior adhesion.
Package includes:
- 1 x Base
- 10 x Positioning Plate
- 10 x Stencil
Customer reviews
0.0/ 5.0
0
0
0
0
0
