Multi-Function BGA Reballing Positioning Fixture – Motherboard Cooling, Soldering & Desoldering Platform for iPhone X
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Product details
Description
Multi-Function BGA Reballing Positioning Fixture – Motherboard Cooling, Soldering & Desoldering Platform for iPhone X
Key Benefits:
- High‑efficiency heat conduction – Pure copper block transfers heat evenly, preventing tin‑burst on the IC; a heat‑conduction sticker isolates metal from the chip.
- Automatic CPU positioning – Built‑in positioning structure eliminates manual alignment, boosting repair success rate.
- Stable, non‑slip design – Foot pads keep the platform steady during operation.
- Integrated tin‑plating layer – Precision stencils produced with world‑leading laser technology.
- Motherboard layer separation – Dedicated structure for easy separation and accurate installation.
- Precision positioning column – Streamlines separating, soldering and component installation.
- Durable copper surface – Special treatment keeps the copper’s color looking new.
- High‑temperature synthetic stone base – Tested up to 500 °C for direct heating, resistant to deformation.
Package Includes:
1 × Working Platform
1 × NAND BGA Reballing Net
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