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MiJing Special Design Hot Air Gun Nozzle – Heat Gun Rework Nozzle for Quick 861DW / 2008 Hot Air Soldering Station, ideal for iPhone X motherboard / mainboard repair

MiJing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle for Quick 861DW 2008 Hot Air Solderi

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ID: MV-103579
Weight: 0.05 kg
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Compatible for Quick 861DWCompatible for Quick 861DWCompatible for Quick 2008Compatible for Quick 2008

Product details

Description

MiJing Special Design Hot Air Gun Nozzle – Rework Nozzle for Quick 861DW / Quick2008 Hot Air Soldering Station (iPhone X Motherboard, mainboard not included)

Key Features:

  • Dedicated design for iPhone X motherboard – enables easy and quick disassembly of double‑layer boards.
  • Protects critical components such as NAND/PCIe, CPU, Wi‑Fi, and baseband – prevents accidental solder bridges.
  • Compatible exclusively with Quick 861DW or Quick 2008 stations. Buy Quick 861DW or Buy Quick2008.
Package Includes:
1 × Hot Air Gun Nozzle

MiJing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle for Quick 861DW 2008 Hot Air Solderi
MiJing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle for Quick 861DW 2008 Hot Air Solderi
MiJing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle for Quick 861DW 2008 Hot Air Solderi
MiJing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle for Quick 861DW 2008 Hot Air Solderi

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