MiJing 2-in-1 BGA Reballing Stencil Platform Jig Fixture – Motherboard Fixture for iPhone X

MiJing 2 in 1 BGA Reballing Stencil Platform Jig Fixture
Professional BGA reballing fixture designed for iPhone X and its motherboard. It enables precise positioning and efficient reballing of BGA components on the iPhone X PCB, delivering fast, damage‑free results and the best solution for repair and reballing tasks.

Key Features:
• All‑in‑one platform for iPhone X main board positioning and BGA reballing.

• Place the iPhone X main board onto the platform.
• Cover the board with the BGA reballing stencil.
• Evenly spread solder paste (tin) over the stencil.
• Remove the stencil after the paste is applied.
• Detach the motherboard and use a hot‑air gun to solidify the solder balls.

Package Includes:
1 × MiJing 2 in 1 BGA Reballing Stencil Platform