Original MJ 3D A11 BGA Reballing Stencil Plant Tin Steel Net for iPhone 8 / iPhone 8 Plus / iPhone X Touch IC, Baseband, font IC, audio IC, power IC, A11 CPU
3D Design enables stencil to align with tinning position of IC rapidly. makes it easier to take out the formed solder balls. easy to use no matter you are a new or expert.
High success rate of planting tin,the solder balls can be formed once after you are proficient.
High-temperature resistant that can be heated directly by the hot air gun.