Maples PPD 120X Heater Mini Intelligent Remove Welding Platform – Desoldering, Demolition & Rework Station for iPhone X Middle Frame, Middle-Level Layer Board Separation
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Seller: Martview Shenzhen
ID: MV-103577
Weight: 1.00 kg
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Product details
Description
Maples PPD‑120X Mini Intelligent Desoldering & Rework Station
Professional tool for iPhone X logic board repair – separates upper/lower logic boards at 230 ℃ without a hot‑air rework station. Includes gold, red, and random colors.
Key Features
• Fast, efficient pre‑heating and removal of welding
• Works on middle‑frame and middle‑level layer boards
• No hot‑air required
• Temperature range up to 240 ℃
• Compact, portable design
Temperature Settings
Summary: Adjustable temperature zones for demolition, glue softening, CPU work, desmearing, re‑balling, and soldering.
- Demolition shield: 180 ℃‑220 ℃
- CPU‑side glue: 180 ℃‑220 ℃
- A11 CPU demolition: 230 ℃‑240 ℃
- Desmearing: 180 ℃‑200 ℃
- Re‑ball BGA chip: 180 ℃‑200 ℃
- A11 CPU soldering: 190 ℃‑210 ℃
Package Includes
1 × Maples PPD‑120X Mini Intelligent Remove Welding Platform
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