PPD CPU Heating Platform for IC Chip Heating De-gumming and De-tinning

PPD CPU Heating Platform for IC Chip Heating De-gumming and De-tinning

Features:

• A key of heating, rapid heating, the temperature can be adjusted 160~250℃, support multi-generation Apple, Huawei chip glue removal, tin removal work

• Applicable to 99% of the chips on the market, 20*18.5mm work area, support for multi-generation Apple cell phones, Huawei cell phone chip universal hard disk, and CPU de-gumming and de-tinning

• When heating, the temperature can be adjusted between 160℃, and 250℃, to effectively avoid burning the chip due to high temperature or improper adjustment

• Air gun heating is safer than 100 lower than the air gun temperature scraping, free iron heating without repeated scraping of iron, and no damage to the pad

• After heating to a set temperature, use a face-to-face sign to clean the residual tin without damaging the pad paint, non-absorbent tin belt back to wipe, and wear the chip for a long time

• Fast heating, no leakage, no static electricity, safer, curve heating, built-in professional adjustment curve, no need to worry about thermal stress caused by chip damage

• Hidden screw, flexible and lightweight, flexible telescopic clamping while hidden screw to prevent residue falling into the screw, more durable and better use

Package includes:

• 1 x Heating Platform