WL High-Quality 4 in 1 NAND Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil with Fixed Plate for iPhone 5 5C 5S

BGA Reballing Stencil

WL High-Quality 4 in 1 NAND Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil with Fixed Plate for iPhone 5 5C 5S

  • Vendor:Martview
Availability: In Stock
US $39.90
or

WL High-Quality 4 in 1 NAND Baseband A6 A7 CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil for iPhone 5 5C 5S
With Fixed Plate, Easy to use and more accurate IC welding position

Package include:
1 x Steel Net
1 x Fixed Plate