WL High-Quality 4 in 1 NAND/PCIE Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil with Fixed Plate for iPhone 6S / 6S Plus

BGA Reballing Stencil

WL High-Quality 4 in 1 NAND/PCIE Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil with Fixed Plate for iPhone 6S / 6S Plus

  • Vendor:Martview
Availability: In Stock
US $39.90
or

WL High-Quality 4 in 1 NAND/PCIE, Baseband, A9 CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil for iPhone 6S 6S Plus
With Fixed Plate, Easy to use and more accurate IC welding position

Package include:
1 x Steel Net
1 x Fixed Plate