QUICK 850A+ Blower Hot Air Rework Station 1000W 220V Heat Gun Lead-free Soldering Station for Fix Phone Repair BGA Chip IC Tools - Malaysia

Specifications: hot air bga smd rework station Quick 850A+ 1. Original Quick smd rework 2. Constant temperature 3. igh stability, long using life. Function: 1. Prevent static electric and creepage to damage the PCB. 2. Don’t need to touch the PCB, which can avoid element moving and heating impaction. 3. Extensively adjust airflow and temperature and select different nozzles, so it can fit most of SMD. 4. Use inlet heating element, the type of heating element and nozzle is same as the international. 5. Delay to blow cool airflow when turn the power switch off, it can protect the unit. Applications: 1. Fits most of SMD, Such as SOIC, CHIP, QFP, PLCC, BGA etc. 2. Contract hose. Brand Quick Model 850A+ Power 270W Voltage 110V 220V Frequency 50/60HZ Capacity 24L/min (max) Unit Weigh 4.1kg 1 Before Operation 1. Select the tweezers that matches the size of IC. 2. Select the nozzle that matches the size of the IC. Attach the nozzle when both the pipe and the nozzle are cool. 3. Loosen the screw on the nozzle. 4. Attach the suited nozzle as shown in the drawing. 5. Fasten the screw properly.

2.2 QFP De-soldering 1. Plug the power cord into the power supply. 2. Turn the power switch on. Once the power switch is turned on, the heating element will begin to warm up. 3. Adjust the airflow and temperature control knob. Wait for a while after adjusting the airflow and temperature, till the temperature is stable. Refer to the distribution chart. We suggest you may adjust the temperature to 300℃~350℃. As for airflow, in case of single nozzles, set the airflow knob at 1~5. For other nozzles, set it at 4~8. When using a single nozzle, set the temperature control knob less than 6. 4. Melt the solder. Hold the iron and so that the nozzle is located directly over, but not touching the IC. Let the hot airflow melt the solder. Be carefully not to touch the leads of IC with the nozzle. 5. Remove the IC. Once the solder has melted, remove the IC by lifting the tweezers. 6. Turn the power switch off. After the power switch is turned off, an automatic blowing function begins sending cool airflow through the pipe in order to cool the heating element and the handle. If don’t use the unit for a long time, disconnect the plug. 7. Remove any residue of the solder. After removing the IC, remove the residue of the solder with a wick or de-soldering tool.