Relife RL-044 0.12mm Middle Layer BGA Reballing Stencil for iPhone 16 / 16 Plus / 16 Pro / 16Pro Max
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Seller: Martview Shenzhen
ID: MV-240926ZRMPP8
Weight: 0.02 kg
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| 3 | NaN | -2.9% |
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IPM18/for iPhone 16/16 Plus
IPM19/for iPhone 16 Pro/16Pro MaxProduct details
Description
Relife RL-044 0.12mm Middle Layer BGA Reballing Stencil for iPhone 16 / 16 Plus / 16 Pro / 16Pro Max
Package includes:
- 1 x Stencil
Notice: Remove the heat dissipation sticker on the bottom of the motherboard then plant the tin, please remove the steel stencil before heating!!!
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