Relife RL-044 Android Series BGA Reballing Stencil Set for Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA

Relife RL-044 Android Series BGA Reballing Stencil Set for Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA

Features:

• RL-044 Android series chip planting tin steel stencil set, precise alignment, fast and convenient, high-quality steel, round square holes, high-temperature resistance, no deformation

• Supports Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos/BGA/Android and other series

• Use mobile phones for actual measurement to ensure accuracy, each mesh is calibrated according to the mobile phone drawings to ensure that every solder joint is indispensable

• It is specially designed and used for mobile phone chips, the round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips

• Ultra-thin and super tough, ultra-thin design, better fit of tin planting, continuous bending, and full toughness

• High temperature and wear resistance, high-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance, so that each tin point is heated evenly

• The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls

Package includes:

• 58 x Stencil