Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair
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Seller: Martview Shenzhen
ID: MV-221115133RA7
Weight: 0.10 kg
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Product details
Description
Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair
Features:
- RL-404 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repair
- Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store
- Low Melting Point /High Density/High Resistance Strong Activity/Strong Welding Force
- Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution
- Meet the maintenance needs of motherboards for Huawei and Apple high-end machines
Package includes:
- 1 x Tin Paste
Noted:
Due to FedEx DHL can not send out the parcel that comes with Liquid, so we just can send out it by Singapore Post - Standard Mail or Registered Mail. If your order has other products, we will take out this to send by Singapore Post - Standard Mail or Registered Mail, and other products will send out by the courier which you choose. Thanks for understanding.
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