Relife RL-601MA iPhone CPU Lower Layer Tin Planting Platform Set for iPhone 6 to 16Pro Max A8 to A18

Relife RL-601MA iPhone CPU Lower Layer Tin Planting Platform Set for iPhone 6 to 16Pro Max A8 to A18

Features: 

• iPhone CPU tin planting platform set suitable for A8/A9/A10/A11/A12/A13/A14/A15/A16/A17/A17Pro/A18A/A18Pro CPU

• Automatic and precise alignment / Universal chip slot structure / Integration of positioning / Glue removal / Tin planting

• Precise positioning / Fast tin planting / Strong magnetic adsorption / Automatic clamping

• Using a new type of magnetic power original positioning, strong magnetic automatic clamping, convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping

• Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged

• General more IC clamps such as chip CPU/hard disk/font library; place the chip fixedly in the upper left corner of the chip slot (let the magnetic suction module automatically withstand the edge of the chip, which can cover the corresponding chip tin-planting steel stencil

• High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls

• Anti-drum, so that each solder ball is round and full, to meet the needs of various chips

• High quality environmentally friendly stone, high strength, anti-dirt, easy to clean

• Wear-resistant and anti-skid, shock absorption and compression resistance, anti-aging

Package includes:

• 1 x Fixture

• 12 x Steel mesh