Relife RL-601MA Universal BGA Reballing Planting Tin Base for iPhone / HiSilicon / Qualcomm / MTK
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Seller: Martview Shenzhen
ID: MV-230629M3749E
Weight: 0.20 kg
| Qty | Price | Discount |
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| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
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Description
Relife RL-601MA Universal BGA Reballing Planting Tin Base for iPhone / HiSilicon / Qualcomm / MTK
Features:
- RL-601MA universal CPU chip planting tin fixture can be used for all kinds of BGA mobile phone chips and supports multiple CPU maintenance positioning
- Strong magnetic adsorption / Precise positioning / High-quality synthetic stone / High-temperature resistance / Anti-static
- Adopt new magnetic power original positioning, strong magnetic automatic clamping, convenient and flexible, support multiple CPU maintenance positioning, stable and reliable clamping
- Embedded high-temperature magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism unchanged
- Universally more chip CPU/hard disk/font library and other IC clamping; fixedly place the chip in the upper left corner of the chip slot (let the magnetic suction module automatically withstand the edge of the chip to cover the corresponding chip tin-planting steel mesh)
- Unlimited expansion and strong versatility, universal for all kinds of BGA chips, support IP series, HiSilicon series, Qualcomm series, and other CPU repair positioning
- Magnetic adsorption steel mesh, free hands, scrape tin without moving, more uniform
- High-quality environmentally friendly stone, high strength, anti-dirt, easy to clean
- Wear-resistant and non-slip, shock-absorbing and compression-resistant, anti-aging
Package includes:
- 1 x Base
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