RF4 RF-MRP8 Middle Layer BGA Reballing Stencil Tin Plating Platform Set for iPhone X to 18P / 18PM
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Seller: Martview Shenzhen
ID: MV-261113D52116
Weight: 0.80 kg
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| 3 | NaN | -3.1% |
| 5 | NaN | -5.4% |
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Product details
Description
RF4 RF-MRP8 Middle Layer BGA Reballing Stencil Tin Plating Platform Set for iPhone X to 18P / 18PM
Package includes:
- 25 x Stencil
- 8 x Positioning Plate
- 1 x Magnetic Base
Customer reviews
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