Goot Wick Sucking Wire – BGA Desoldering Solder Wire, Tin Absorption Line for BGA
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CP-1515-1.5mm WidthCP-2015-2.0mm WidthCP-2515-2.5mm WidthCP-3015-3.0mm WidthCP-3515-3.5mm Width
Product details
Description
Sucking Line BGA Desoldering Solder Wire – BGA Tin Absorption Line
Feature Summary: Quickly removes excess solder, safe when handled correctly, available in multiple sizes.
- Quickly removes unwanted solder when used with a soldering iron.
- Only touch the grip and the pack of desoldering wick when desoldering. Failure to do so will result in serious burns.
- To avoid fire, never use a soldering iron and desoldering wick around combustibles or in an explosive environment.
- Do not force the tip against the desoldering wick to avoid injury to yourself and/or damage to the parts and PCB.
- Do not heat the desoldering wick for more than 5 seconds to avoid damage to the parts and PCB.
- Different sizes available for selection.
Use:
- Place the desoldering wick over the solder to be removed, then press the heated soldering‑iron tip onto the wick. The solder will be absorbed.
- Remove the wick after the solder has been absorbed.
- Cut off the used section of the wick using nippers.
Package includes:
1 × Solder Wire
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