Sunshine SS-T12B Universal Intelligent Motherboard Heating Platform for Android & iPhone 7 to 16PM
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Seller: Martview Shenzhen
ID: MV-241126MG9P4W
Weight: 1.90 kg
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only T12B-IP1 Moduleonly T12B-IP2 Moduleonly T12B-IP3 Moduleonly T12B-IP4 Moduleonly T12B-IP5 Moduleonly T12B-IP6 Moduleonly T12B-IP7 Moduleonly T12B-IP8 Moduleonly T12B-IP9 Moduleonly T12B-IP10 Moduleonly T12B-IP11 Moduleonly T12B-IP12 ModuleHost + T12B-IP10 Module/110VHost + T12B-IP10 Module/220V9-IN-1 Set/Host + 8Pcs Module /110V9-IN-1 Set/Host + 8Pcs Module /220V13-IN-1 Set/Host + 12Pcs Module/110V13-IN-1 Set/Host + 12Pcs Module/220VExtra Adapter
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Product details
Description
Sunshine SS-T12B Universal Intelligent Motherboard Heating Platform for Android & iPhone 7 to 16PM
Features:
- SS-T12B Multi-functional universal intelligent maintenance heating Platform, support Android+iPhone series / Upgradable and expandable design / Safe and fast layered fit / No air gun soldering iron
- Supports bonding and separation of Android and iPhone 7G to 14Pro Max motherboards, separation of screen frames, etc., and will continue to be updated in the future
- Precise temperature control / Smart digital display / Rapid heating / Unlimited expansion
- Modular design, a variety of combined modules, common modules on the base, good scalability, easy-to-expand new modules
- The heating area is large, the compatibility is good, and it supports the desoldering operation of various motherboard components, which is more convenient and quick
- Intelligent temperature control, customized temperature adjustment according to different melting points, with fast heating, long life, and uniform temperature
- Supports bonding and separation of Android and iPhone X to 16Pro Max motherboards, separation of the screen frame, etc., fast and accurate layering, tin planting, glue removal, and bonding of motherboards, etc
- 360° rotating buckle + guide rail design, suitable for precise clamping of motherboards of different shapes, improving maintenance efficiency
- Module quick-release buckle, easy to take out and put in. (Note: before replacing the module after heating, be careful of residual heat burns)
- Precise positioning, the module is equipped with a positioning column, which can be accurately separated and attached to the main board, and is easy to take
- Heat dissipation and anti-slip design, hollow heat dissipation design, high-temperature resistance; Silicone wear-resistant foot pads, stable operation, good anti-skid effect
The Modules used for:
- T12B-IP1: Common for most models of screen bracket separation/fingerprint repair/CPU chip degumming/face repair
- T12B-IP2: Fingerprint repair/A12/A11/X/XS/XSM motherboard delamination
- T12B-IP3: iPhone 11/11P/11PM/A13 motherboard layering
- T12B-IP4: CPU chip degumming/12/12Mini/12P/12PM motherboard layering
- T12B-IP5: iPhone 13/13Mini/13P/13PM/A15 motherboard layering
- T12B-IP6: iPhone 14/14Plus/14P/14PM/A15/A16 motherboard layering
- T12B-IP7: iPhone X/XR/XS/XSM/12P/12PM/13/13Mini camera
- T12B-IP8: iPhone 11/11P/11PM/13P/13PM camera
- T12B-IP9: iPhone 7G/7P/8G/8P/11/12/12Min/14/14Plus/14P/14PM camera
- T12B-IP10: Android universal
- T12B-lP11: iPhone 15/15Plus/15P/15PM/A16/A17 motherboard layering
- T12B-lP12: iPhone 16/16Plus/16P/16PM/A18/A18Pro motherboard layering
Package includes:
- According to your choice
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