TBK 2202 New 3D Thermal Imaging Motherboard Fault Diagnosis Instrument with Mobile Phone Holder

TBK 2202 New 3D Thermal Imaging Motherboard Fault Diagnosis Instrument with Mobile Phone Holder

Features:

• TBK 2202 3D thermal imaging fault diagnosis instrument, quickly and accurately detects fault points on the motherboard circuit through infrared thermal imaging technology

• Fault detection knows at a glance quickly locates faulty components

• It can be connected to mobile phones. tablets and computers, three connections are easy to use (support Android system, Windows system)

• Using a high-resolution thermal imager, it can clearly display the temperature distribution on the motherboard, making faulty components visible at a glance

• Intelligent troubleshooting automatically analyzes thermal imaging data to track motherboard failure points

• Adjustable lens, lens height can be adjusted up or down to make the focus clearer

• Foldable storage: The product is foldable and has a lightweight design, making it easy to carry and store, and suitable for various maintenance occasions

Specification:

• Brand: TBK

• Resolution: 256*192

• Wavelength range: 7.5um~13.5um

• Camera angle: 250*18°

• Temperature Measurement Range: -20℃~550℃

• Temperature measurement distance: 5cm~25cm

• Base Size: 152*160mm

• Supported platforms: Android, Windows

• Product Size: 160*152*280mm

• Product Weight: 830g

Package includes:

• 1 x Infrared Thermal Imager

• 1 x Phone Holder