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TE Series Mobile Phone Soldering Repair High-Temperature Resistant Heat Insulation Silicone Pad

te series-mobile-phone-soldering-repair-high-temperature-resistant-heat-insulation-silicone-pad-1

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ID: MV-2410223C16YG
Weight: 0.45 kg
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Please select Type

Choose a Type
TE-608/MagneticTE-608/MagneticTE-616/MagneticTE-616/MagneticTE-613/Non-MagneticTE-613/Non-MagneticTE-615/Non-MagneticTE-615/Non-Magnetic

Product details

Description

TE Series Mobile Phone Soldering Repair High-Temperature Resistant Heat Insulation Silicone Pad

Features:
  • It can be curled, twisted, and rotated at will without deformation, and it has good elasticity and can quickly return to its original shape
  • It is hydrophobic, easy to dry, easy to handle, and does not easily leave stains
  • Each one is individually identified with a number to avoid screws being misplaced
  • High temperature does not cause swelling, protecting the desktop from damage
  • Using an air gun, soldering iron or other high-temperature soldering station operations can have a heat insulation effect, and the high-temperature resistance can reach 500°C
  • Hydrophobic and easy to dry, easy to care for, not easy to leave stains, easy to clean, keeps your desktop tidy
  • The ruler is clearly visible, making work easier and simpler

Specification:
TE-616 Insulation Pad (Magnetic)
  • Product size: 400*290mm
  • Upper limit thickness: ≈5.3mm
  • Lower limit thickness: ≈1.8mm

TE-608 Insulation Pad (Magnetic)
  • Product size: 350*250mm
  • Upper limit thickness: ≈4.5mm
  • Lower limit thickness: ≈2mm

TE-613 Insulation Pad (Non-Magnetic)
  • Product size: 350*250mm
  • Upper limit thickness: ≈4.5mm
  • Lower limit thickness: ≈2.1mm

TE-615 Insulation Pad (Non-Magnetic)
  • Product size: 350*220mm
  • Upper limit thickness: ≈4.5mm
  • Lower limit thickness: ≈1.8mm

Package includes:
  • 1 x Pad
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