Ugain High-toughness IC Chip Remove Repair Soft Blade for Mobile Phone Repair
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Seller: Martview Shenzhen
ID: MV-2308166H3426
Weight: 0.01 kg
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| 1 | NaN | |
| 3 | NaN | -2.1% |
| 5 | NaN | -3.5% |
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Handle with BladeProduct details
Description
Ugain High-toughness IC Chip Remove Repair Soft Blade for Mobile Phone Repair
Features:
- Aluminum alloy material, comfortable to hold, hand-polished blade, ergonomic handle
- The edge-cutting glue can be solved to remove the CPU back/middle glue
- Aluminum alloy material, pure copper locks, nonslip line, easy to hold
- Used for glue removal of motherboard chip, CPU, baseboard, and hard disk
- Remove CPU, bottom plate, and hard disk glue, suitable for chip sealing, glue, and tin removal
Package includes:
- 1 x Knife Handle
- 1 x Blade
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