Universal CPU BGA Tin Planting and Glue Removal Platform for Qualcomm / HiSilicon / MediaTek / iPhone
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Seller: Martview Shenzhen
ID: MV-221013L89176
Weight: 0.60 kg
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| 1 | NaN | |
| 3 | NaN | -3.1% |
| 5 | NaN | -5.4% |
| 10 | NaN | -8.5% |
Product details
Description
Universal CPU BGA Tin Planting and Glue Removal Platform for Qualcomm/HiSilicon/MediaTek /iPhone
Features:
- Universal tin-planting and glue removal platform, including 43 tin-planting stencils, 6 font nets, 18 Qualcomm CPU nets, 8 HiSilicon CPU nets, 9 MediaTek CPU nets, 9 Apple nets for A8 to A16, unlimited upgrades
- Precise positioning slotting, magnetic suction design stable
- High-temperature resistance, planted tin fine who
Package includes:
- 1 x Base
- 52 x Stencil
Customer reviews
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