WDS-700 Optical Alignment BGA SMD Rework Station – Mobile Phone, iPhone, Samsung Motherboard BGA IC Repair & Replacement
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Product details
Description
Feature:
Independent Two-Temperature Control System
Summary: Precise dual‑zone heating (±1 °C), up to 8 zones simultaneously, with independent upper/lower control for uniform PCB heating.
- The upper and lower zones are heated by hot air with temperature accuracy of ±1 °C. Both zones can heat from the component top and PCB bottom simultaneously, or up to 8 zones at once for even heating.
- Local heating of the BGA chip and PCB can be performed together. Upper or lower zones can be used independently, allowing free combination of heating elements.
- High‑precision K‑type thermocouple closed‑loop control with PID auto‑tuning; displays four temperature curves, stores multiple user data sets, offers instant curve analysis, and includes an external temperature measurement interface for accurate BGA temperature monitoring. Touch‑screen allows canceling analysis, setting, and correcting temperature parameters.
Precise Optical Alignment System
Summary: High‑definition CCD vision with zoom, auto‑focus, color correction, and a 15‑inch HD LCD for accurate component placement.
- Adopts a high‑definition adjustable CCD color optical vision system with split light, zoom in/out, auto‑focus, automatic color‑difference resolution, and brightness adjustment; features a 15‑inch HD LCD screen.
Multi‑Functional Humane Operating System
Summary: Touch‑screen interface, integrated heating and placement head, 360° titanium alloy BGA nozzle, and micrometer‑adjusted X/Y/R axes for ±0.01 mm accuracy.
- High‑definition touch man‑machine interface; integrated upper heating device and placement head; equipped with various titanium‑alloy BGA nozzles that rotate 360°, easy to install and replace.
- X, Y and R angles are fine‑adjusted with a micrometer; alignment accuracy up to ±0.01 mm.
Superior Safety Protection Function
Summary: Alarm after operation, automatic power‑off, double over‑temperature protection, and password‑protected temperature settings.
- After welding or desoldering, an alarm notifies completion. Under unsafe temperature or space conditions, the circuit automatically powers off with dual over‑temperature protection. Temperature parameters are password‑protected to prevent unauthorized changes, along with other security features.
Product Application
- BGA rework station can be used for:
- Laptop / Notebook / Computer motherboard repair.
- PlayStation / XBOX 360 and other game console repair.
- Mobile phone motherboard repair.
- TV / Video / iPad mainboard repair.
- SMD / SMT / IC BGA rework.
Repair Steps
- Desolder the BGA chip from the motherboard.
- Clean the pad.
- Reball or replace with a new BGA chip.
- Alignment/Positioning – based on experience, silk frame, optical camera.
- Solder the new BGA chip.
