Welsolo VS04 Universal 0.3 / 0.35 / 0.4 / 0.5 BGA Reballing Stencil for Mobile Phone BGA Chip Repair
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Seller: Martview Shenzhen
ID: MV-230225L1D5Q3
Weight: 0.01 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
Product details
Description
Welsolo VS04 Universal 0.3 / 0.35 / 0.4 / 0.5 BGA Reballing Stencil for Mobile Phone BGA Chip Repair
Package includes:
- 1 x Stencil
Customer reviews
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