WL 0.12MM Multi-Function BGA CPU Reballing Stencil – Plant Tin Steel Net compatible with MTK, Qualcomm, and HiSilicon
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Product details
Description
WL 0.12MM Multi-Function BGA CPU Reballing Stencil – Plant Tin Steel Net for MTK, Qualcomm, HiSilicon
Key Features:
• Broad compatibility with MTK, HiSilicon and Qualcomm chipsets
• Precise 0.12 mm stencil for reliable re‑balling
• Durable plant‑tin steel mesh ensures long‑term performance
• Multi‑function design supports both upper and lower die re‑balling
Supported Chipsets:
- MTK C1: MT6272A, MT6582, MT6589, MT6580A, MT6755, MT6595
- MTK C2: MT6750, MT6797W Upper, MT6797W Lower, MT6735, MT6732, MT6795W
- HiSilicon C1: HI3660 Upper, HI3660 Lower, HI3630 Upper, HI3630 Lower, HI3650 Upper, HI3650 Lower
- HiSilicon C2: HI6520, HI3630 Upper, HI3630 Lower, HI6620, HI6220
- Qualcomm C1: MSM8992 Upper, MSM8992 Lower, MSM8996 Upper, MSM8996 Lower, MSM8976 Upper, MSM8976 Lower
- Qualcomm C2: MSM8928 Upper, MSM8928 Lower, MSM8994 Upper, MSM8994 Lower, MSM8960 Upper, MSM8960 Lower
- Qualcomm C3: MSM8974 Upper, MSM8974 Lower, MSM8998 Upper, MSM8998 Lower, MSM8937, MSM8940
- Qualcomm C4: SDM660, MSM8952, MSM8953 1AB, MSM8953 B01, MSM8916, MSM7225A, MSN8612, MSM8909
Package Includes:
1 × Reballing Stencil
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