WL iPhone 17 Series Extended Module for WL HT007 Intelligent Mainboard Layered Soldering Station
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Seller: Martview Shenzhen
ID: MV-251209Q4MWMF
Weight: 0.52 kg
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| 3 | NaN | -3.1% |
| 5 | NaN | -4.7% |
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Product details
Description
WL iPhone 17 Series Extended Module for WL HT007 Intelligent Mainboard Layered Soldering Station
Since the iPhone 17 series motherboards lack positioning holes, do not support solder tin planting, this series does Not include solder reballing stencil!!!
Package includes:
- 1 x Extended Module
- 1 x Cable
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