WL Mini Magical Degumming Station for Phone IC Chips Heating & Degumming

WL Mini Magical Degumming Station for Phone IC Chips Heating & Degumming

Features:

• USB power supply, adjustable temperature 160℃~250℃

• No air gun heating, no soldering iron heating, no soldering tape, do not hurt the pad, do not hurt the plate paint

• Concealed screw, flexible and lightweight, flexible telescopic clamping, and concealed screw prevent residues from falling into the screw, which is more durable and better to use

• Once the degumming table has been heated to a set temperature, a brush or cotton ball can be used, and a cotton swab to remove residual tin, no need for suction wire, one wipe can easily remove tin and glue, tin planting is easy, convenient, and fast

• After heating to a set temperature, a cotton swab can be used to dispose of the tin residue, do not hurt the pad paint, do not absorb the tin belt to wipe back, and wear the chip for a long time

• Air gun heating is 100 degrees lower than air gun temperature, and squeegee is safer, no soldering iron heating, no need for repeated scraping of a soldering iron, and no damage to the pad

• 20mm x 18.5mm working area for multiple generations Apple mobile phone chips, Huawei mobile phone chips, general hard disks CPU glue, and tin removal

Package includes:

• 1 x Degumming Station