WL Multi-Function BGA Reballing Stencil with Plant Tin Steel Net for Huawei
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Product details
Description
WL Multi-Function BGA Reballing Stencil – Tin Steel Net for Huawei Devices
Product Overview:
Designed for precise BGA reballing on CPUs, fonts, audio, power ICs, USB control ICs, HDD NAND, baseband, EEPROM and more.
Key Features:
• Universal Compatibility: Supports a wide range of Huawei models, including MT7, MTS, P8S, G7, G8, 7I, 5S, P8 Youth Edition, P9 Youth Edition, and P7.
• High‑Quality Construction: Made from durable tin‑coated steel net for reliable reballing performance.
• Multi‑Function Design: Suitable for CPU, audio, power, USB, HDD, and other IC reballing tasks.
- HW‑1: Huawei MT7 / MTS / P8S
- HW‑2: Huawei G7 / G8 / 7I / 5S
- HW‑3: Huawei P8 Youth Edition / P9 Youth Edition
- HW‑4: Huawei P7
Package Includes:
1 × BGA Reballing Stencil
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