WL Multi-Function BGA Reballing Stencil Plant Tin Steel Net – Compatible with OPPO, VIVO, Meizu
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OP:1OP:2OV:1OV:2
Product details
Description
WL Multi-Function BGA Reballing Stencil – Tin Steel Net for Oppo, Vivo, Meizu and More
Key Features:
• Universal compatibility with CPU, Font, Audio, Power IC, USB Control IC, HDD NAND, Baseband, EEPROM and other ICs.
• High‑precision tin‑steel mesh for reliable reballing.
Device Compatibility:
- OV:1 – R9, A37, A59, Y67, Meizu 5, 3, 3S, 6
- OV:2 – OPPO, VIVO
- OP:1 – R9P, R9S, VIVO X6, X7, X9P, Max
- OP:2 – R11, VIVO X20, MI NOTE3
Package Includes:
1 × BGA Reballing Stencil
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