WL Multi-Function BGA Reballing Stencil – Plant Tin Steel Net Compatible with Samsung S8 / S7 / S6 / S5, NOTE8 / NOTE5, A7 / A5 / A3, J7 / J5 / J3
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Product details
Description
WL Multi-Function BGA Reballing Stencil – Tin Steel Net for Samsung & Others
Key Features:
• Universal compatibility: Supports a wide range of Samsung, Apple, and other devices for CPU, audio, power, USB, HDD NAND, baseband, EEPROM, etc.
• High‑precision tin steel mesh: Ensures accurate ball placement and reliable reballing.
• Easy to use: One‑piece stencil ready for immediate application.
Device Compatibility:
- SAM:1 – S8 / S8+ / NOTE 8 / G9500 / G955U / N9550
- SAM:2 – S7 / G9300 / 9350 / 9308
- SAM:3 – S6 / S6+ / NOTE 5 / G9200 / 9250 / N9200
- SAM:4 – A520 / A310 / S5 mini / A7 / A5 / A3 / S5 / J7
- SAM:5 – A9 / C9 / A9000 / A9100 / C9000
- SAM:6 – C7010 / J610 / C7 / J3 / J5 / A5
Package Includes:
1 x BGA Reballing Stencil
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