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Wylie Built-in MEP Dual SIM + ESIM Integrated Solution for iPhone 17 Pro / 17Pro Max US Version

wylie built-in-mep-dual-sim-esim-integrated-solution-for-iphone-17-pro-17pro-max-us-version-1
wylie built-in-mep-dual-sim-esim-integrated-solution-for-iphone-17-pro-17pro-max-us-version-1
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ID: MV-2604039WE248
Weight: 0.08 kg
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Product details

Description

Wylie Built-in MEP Dual SIM + ESIM Integrated Solution for iPhone 17 Pro / 17Pro Max US Version
This kit is a specialized integrated circuit solution designed for modifying the US versions of iPhone 17Pro and 17ProMax. It allows the phone to natively support the use of two physical SIM cards alongside an eSIM, providing greater flexibility for network connectivity and management.

Features:
  • Built-in MEP 2 SIM + eSIM Support: Achieves true dual physical card and eSIM functionality through the integrated MEP (Multiple Enabled Profile) solution
  • SIMHUB IC Compatibility: The core of the kit includes a dedicated SIMHUB IC chip. This advanced chip is crucial for managing and stabilizing the signals from multiple SIMs, ensuring reliable performance and network compatibility.
  • No Drilling Required Installation: The modification is designed to be installed internally. A significant advantage is that it does not require drilling any holes in the phone's frame or body, preserving the structural integrity and aesthetics of your iPhone 17 Pro/17Pro Max.
  • Direct Point-to-Point Welding: The modification process involves direct, precise soldering connections (point-to-point welding) on the phone's logic board. This method is stable and eliminates the need for messy and unreliable "flying wires."
  • Clear Motherboard Markings for Guidance: The kit references or is used alongside detailed diagrams that mark key test points on the motherboard (e.g., specific resistor values, GND, 3T1). This aids technicians in accurate installation and troubleshooting.

Notes:
  • Professional Skill Required: This modification involves advanced motherboard-level repair. The card-style SIMHUB IC requires manual soldering onto the logic board. It is intended for professional mobile phone repair technicians with experience in micro-soldering.
  • Compatibility is Crucial: This kit is specifically designed for the US version of iPhone 17Pro and iPhone 17Pro Max. It is not compatible with other models or regional variants. Always verify your device model before proceeding.

Package includes:
  • 2 x Cable
wylie built-in-mep-dual-sim-esim-integrated-solution-for-iphone-17-pro-17pro-max-us-version-1
wylie built-in-mep-dual-sim-esim-integrated-solution-for-iphone-17-pro-17pro-max-us-version-2
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wylie built-in-mep-dual-sim-esim-integrated-solution-for-iphone-17-pro-17pro-max-us-version-5
wylie built-in-mep-dual-sim-esim-integrated-solution-for-iphone-17-pro-17pro-max-us-version-6

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