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Wylie Mobile Phone Motherboard / IC / Rear Cover Glass Spade Degumming Blades - 200Pcs

wylie mobile-phone-motherboard-ic-rear-cover-glass-spade-degumming-blades-1

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ID: MV-250825WL3Y7U
Weight: 0.25 kg
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Product details

Description

Wylie Mobile Phone Motherboard / IC / Rear Cover Glass Spade Degumming Blades - 200Pcs

Features:
  • Pad glue removal speed scraper, for Solder pad glue removal/Glass back cover glue removal/Chip glue removal/Fast/sharp/safe
  • Respond to various demand scenarios: Removing glue, cutting glue, lifting chips, disassembling CPU layers...
  • Proficient in all kinds of martial arts, high toughness and not prone to deformation
  • Sharp and fast glue removal: Bevel blade design, the glue is removed in one cut without leaving any trace
  • The double-sided cutting edge design enhances the efficiency and quality of glue removal
  • The edges are clean and free of burrs, with a uniform shape and high-standard quality guarantee

Package includes:
  • 200 x Scraper
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