Wylie WL-18A Mobile Phone Motherboard / IC / Rear Cover Glass Spade Degumming Blades - 200Pcs
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Seller: Martview Shenzhen
ID: MV-250731A3VSHT
Weight: 0.25 kg
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| 3 | NaN | -2.9% |
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Product details
Description
Wylie WL-18A Mobile Phone Motherboard / IC / Rear Cover Glass Spade Degumming Blades - 200Pcs
Features:
- Pad glue removal speed scraper, for Solder pad glue removal/Glass back cover glue removal/Chip glue removal/Fast/sharp/safe
- Respond to various demand scenarios: Removing glue, cutting glue, lifting chips, disassembling CPU layers...
- Proficient in all kinds of martial arts, high toughness and not prone to deformation
- Sharp and fast glue removal: Bevel blade design, the glue is removed in one cut without leaving any trace
- The double-sided cutting edge design enhances the efficiency and quality of glue removal
- The edges are clean and free of burrs, with a uniform shape and high-standard quality guarantee
Package includes:
- 200 x Scraper
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