XinZhiZao Universal High-Temperature Silicone Pad for IC Chip Soldering

XinZhiZao Universal High-Temperature Silicone Pad for IC Chip Soldering

Features:

• High-temperature silicone pads for magnetic soldering platform, high temperature resistant, soft enough, high toughness, slope design, high compatibility, good permeability

• Matching C4 base for more convenient tinning, full adhesion to C4 base, strong magnetism for chip adhesion, no movement, convenient for tinning

• Soft material, twist at will, folding, stretching can be, easy to store, toughness, durability

• Layered thermal insulation, multi-layer heat dissipation, high-temperature resistance, strong thermal insulation, safe for soldering

• With strong flux magnetism, the heat insulation pad has no loss of magnetism, which can make the base firmly absorb the chip stencil, convenient for tin planting

• Innovative slope design for better chip fit, compatible with thinner IC chips, no overhanging pads, and more uniform

• Good compatibility, suitable for chip thickness below 0.9mm, most of the current cell phone chips assisted tinning

Package includes:

• 1 x Silicone Pad