XZZ Explosion-Proof Gasket for Mid-Layer Bonding in Apple / Android Phone Motherboard Repair

XZZ Explosion-Proof Gasket for Mid-Layer Bonding in Apple / Android Phone Motherboard Repair

Features:

• Peel and use instantly for quick convenience. Adheres to explosion-proof solder with structural support, preventing deformation during compression. Phosphor bronze construction ensures high conductivity and straightforward functionality.

• Revolutionizing maintenance with a new design: simply peel and apply for effortless use. Redefines repair tools by saving time and simplifying procedures.

• Phosphor bronze material delivers superior electrical performance. Gaskets made of phosphor bronze feature low electrical loss, high conductivity efficiency, excellent fatigue resistance, and stable long-term performance without degradation.

• Explosion-proof gaskets are available in two specifications: 0.1MM and 0.08MM, offering broad coverage to meet diverse multi-level applications.

• Use only what you need—tear off the required length for instant use, or cut individual pieces for convenience. Easy to use and store.

Operating Steps:

• 1. Apply solder paste using a solder paste stencil

• 2. Position the gasket at the desired location

• 3. Melt the solder paste on the pad to secure the gasket in place

Package includes:

• 1 x Gasket