XZZ High Conductivity Solder Joint Patch for Mobile Phone Motherboard IC Chip Repair

XZZ High Conductivity Solder Joint Patch for Mobile Phone Motherboard IC Chip Repair 

Features:

• Revolutionary Repair Method: Replaces traditional flying wire and looping techniques. Simply tear off the protective layer to instantly repair. Restores the original solder pad effect with no traces left behind.

• Multi-Specification Design: Available in various shapes and sizes to match different solder pad layouts. Suitable for a wide range of mobile phone motherboard chips, including: IC pads, Double-layer/mid-layer boards, CPU, WiFi, hard drive, audio, and touch IC solder pads

• Premium Material & Construction: Phosphor Bronze Material, Ensures ultra-high conductivity; Surface Antioxidant Treatment, Enhances durability and performance; 30 μm Thickness, Optimal for stable soldering and seamless integration

• Instant Bonding & Improved Efficiency: Enables direct mounting on functional testing racks after spot welding. Saves time and reduces repair costs significantly

How to Use:

• Clean the Area: Use tweezers or a desoldering braid to clean oxidation and debris around the detached solder pad. Ensure a clean surface for optimal bonding.

• Apply the Patch: Use tweezers to position the spot welding patch onto the solder pad. Apply soldering oil and weld the patch in place.

• Insulate & Cure: Apply UV-curable green oil over the repaired area. Use a UV lamp to cure and insulate, restoring the original solder pad appearance and improving repair durability.

• Note: Measurements are manually taken and for reference only. Please refer to the actual product.

Ideal for:

• Mobile phone motherboard chip repairs

• Double-layer and mid-layer board repairs

• CPU, WiFi, audio, touch IC, and hard drive solder pad restoration

• Any scenario requiring fast, stable, and invisible solder pad repair

Package includes:

• 1 x Joint Patch